塑封系统
模塑设备
通过树脂包封使半导体与外部电绝缘的塑封工艺,是确保半导体可靠性所不可或缺的技术。
本公司销售产品为transfer方式的Molding设备(即塑封设备),它通过将流动性树脂从浇口注入半导体芯片周围,并使其固化从而起到保护芯片的作用。此外,本公司还研发和销售采用compression压缩方式的塑封设备,该设备采用将半导体芯片浸入事先液化的流动性树脂内进行树脂固化的方式。半导体制造商寄希望于通过框架与基板尺寸的大型化来提高生产效率,并不断降低生产成本。对于半导体的塑封工序来说,需要应对诸如半导体产品的超薄型、高密度以及超厚功率器件或模组的塑封需求。而本公司的塑封设备能满足客户的不同要求。
产品介绍
压缩成形塑封设备 | 注塑成形封装设备 | 切割分选一体机 | |||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CPM | PMC | LCM | FFT | YPM | Y1R | Y1E | YLC | FMS | PSS | PSE | |||||
CPM1080 | CPM1180 | PMC2030-D | LCM1010 | FFT1030G FFT1030W | YPM1180 | YPM1120 | YPM1080-SP | YPM1080-EP | Y1R1060 | Y1E4120 | YLC2120 | FMS3020 | PSS1020 | PSE1020 | |
MAP-BGA | - | - | ● | - | - | ● | ● | ● | ● | ● | ● | ● | ● | - | - |
PBGA | - | - | - | - | - | ● | ● | - | - | ● | ● | ● | - | - | - |
MAP-QFN | - | - | ● | - | - | ● | ● | - | - | ● | ● | ● | ● | - | - |
单片QFN(方形扁平无引脚封装) | - | - | - | - | - | ● | ● | - | - | ● | ● | ● | - | - | - |
QFP/SOP/DIP | - | - | - | - | - | ● | ● | - | - | ● | ● | ● | - | - | - |
晶圆(WLP) | ● | ● 可对应超大基板 | - | ● | - | - | - | - | - | - | - | - | - | ● | ● |
面板(PLP) | ● | ● 可对应超大基板 | ● | - | - | - | - | - | - | - | - | - | - | ● | ● |
功率半导体 | - | - | - | - | - | ● | ● | - | - | ● | ● | ● | - | - | - |
传感器模块产品 | - | - | ● | - | - | ● | ● | - | ● | - | - | - | - | - | - |
LED | - | - | - | ● | ● | ● | ● | - | - | - | - | - | - | - | - |